EFFECT OF ZINC CONTENT AND TEMPERATURE ON COPPER SOLDERABILITY WITH Sn-xZn (x = 4.5; 90; 95 wt.%) ALLOYS

The aim of this study was to determine the effect of temperature and Zn content on the solderability of Cu substrates with liquid Sn-xZn alloys (4.5; 90; 95 wt.% Zn). Solderability tests were carried out by the wetting balance test which allows th...

more >>

EFFECT OF ZINC CONTENT AND TEMPERATURE ON NICKEL SOLDERABILITY WITH Sn-xZn (x = 4.5, 90, 95 wt%) ALLOYS

The aim of this study was to determine the effect of temperature and zinc content on the solderability of nickel substrates with liquid Sn-xZn alloys (4.5, 90, 95 wt% Zn). Solderability tests were carried out by the wetting balance method which al...

more >>

Perspectives and directions of the development of new generation lead-free soldering alloys and their application possibilities in the consumer electronics lead-free soldering technology

The new technological challenges and the high economical and commercial potential connected with the development of new generation soldering alloys used in the consumer electronics lead-free soldering technology is a subject which is gaining incre...

more >>